Invitation to High-Technology Press for DesignCon 2006 Taking Place
Feb. 6-9, 2006 in Santa Clara, California

DesignCon 2006

SANTA CLARA, Calif.--(BUSINESS WIRE)--Dec. 15, 2005--The first
conference of the New Year, DesignCon 2006 serves as the first forum
to reveal the latest discoveries in design engineering challenges.
Top-level industry leaders will present keynotes addressing critical
industry issues. Additional key experts will participate in various
panels and present their award-winning papers in comprehensive
seminars.


New in 2006, the DesignCon Management Forum. Broadening the scope to
focus on business as well as technical issues, DesignCon 2006 will
feature two days of panel sessions led by senior managers and
executives. DesignCon 2006 will also host several co-located events,
including the Si2 OpenAccess Coalition Conference and the IBIS Summit.

In addition, the second annual DesignVision Awards Ceremony will take
place, recognizing technologies, applications, products, and services
judged as the most unique and beneficial to the industry, many of
which the exhibition floor will showcase. To align with market trends,
DesignCon 2006 will also host exhibition pavilions featuring PCB
technology, semiconductor and IP technology, verification technology,
and emerging technologies.

This year, with more than 100 sessions and tutorials, and more than
200 industry leaders to speak, DesignCon 2006 expects more than 125
companies to exhibit and more than 6,000 industry professionals to
register.

The IEC is pleased to offer you FULL access to the entire conference
and exhibition.

For complimentary registration, please register at:
www.designcon.com/2006/press/reg_press.html.


What: DesignCon 2006

When: February 6-9, 2006

Where: Santa Clara Convention Center - Santa Clara, California

Who: Keynote speakers Brian Halla, Chairman of the Board and
Chief Technology Officer, National Semiconductor; Justin
Rattner, Chief Technology Officer, Intel Corporation; and T.J.
Rogers, Founder, President, Chief Executive Officer, and
Director, Cypress Semiconductors.

Additional speakers include John Bourgoin, President and Chief
Executive Officer, MIPS Technologies; Carl Guardino, President
and Chief Executive Officer, Silicon Valley Leadership Group;
Dennis Harmon, President and Chief Executive Officer, Zenasis
Technologies; Kathryn Kranen, President and Chief Executive
Officer, Jasper Design Automation; Gabriele Saucier, Chairman
of the Board, Design and Reuse S.A.; and Belle Wei, Dean, San
Jose State University.

How to Register: www.designcon.com/2006/press/reg_press.html

For Complete Information: www.designcon.com/2006/


The International Engineering Consortium (IEC) is a non-profit
organization dedicated to catalyzing technology and business progress
worldwide in a range of high technology industries and their
university communities. Since 1944, the IEC has provided high-quality
educational opportunities for industry professionals, academics, and
students. In conjunction with industry-leading companies, the IEC has
developed an extensive, free on-line educational program. The IEC
conducts industry-university programs that have substantial impact on
curricula. It also conducts research and develops publications,
conferences, and technological exhibits that address major
opportunities and challenges of the information age. More than 70
leading high-technology universities are IEC affiliates, and the IEC
handles the affairs of the Electrical and Computer Engineering
Department Heads Association and Eta Kappa Nu, the honor society for
electrical and computer engineers. The IEC also manages the activities
of the Enterprise Communications Consortium.